android_kernel_samsung_sm8650/drivers/iio/temperature
Crt Mori 389fc70b60 iio: temperature: mlx90632 Relax the compatibility check
Register EE_VERSION contains mixture of calibration information and DSP
version. So far, because calibrations were definite, the driver
compatibility depended on whole contents, but in the newer production
process the calibration part changes. Because of that, value in EE_VERSION
will be changed and to avoid that calibration value is same as DSP version
the MSB in calibration part was fixed to 1.
That means existing calibrations (medical and consumer) will now have
hex values (bits 8 to 15) of 83 and 84 respectively. Driver compatibility
should be based only on DSP version part of the EE_VERSION (bits 0 to 7)
register.

Signed-off-by: Crt Mori <cmo@melexis.com>
Cc: <Stable@vger.kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
2019-05-27 10:52:30 +01:00
..
hid-sensor-temperature.c iio/hid-sensors: Fix IIO_CHAN_INFO_RAW returning wrong values for signed numbers 2018-11-16 11:42:12 +00:00
Kconfig iio:temperature: Add MAX31856 thermocouple support 2019-04-04 20:21:05 +01:00
Makefile iio:temperature: Add MAX31856 thermocouple support 2019-04-04 20:21:05 +01:00
max31856.c iio: temperature: max31856: fix uninitialized error return 2019-04-14 13:50:09 +01:00
maxim_thermocouple.c Revert "iio: temperature: maxim_thermocouple: add MAX31856 part" 2018-09-02 10:13:06 +01:00
mlx90614.c i2c: remove i2c_lock_adapter and use i2c_lock_bus directly 2018-07-13 00:09:37 +02:00
mlx90632.c iio: temperature: mlx90632 Relax the compatibility check 2019-05-27 10:52:30 +01:00
tmp006.c iio:temperature: drop assignment of iio_info.driver_module 2017-08-22 22:14:52 +01:00
tmp007.c iio:temperature: drop assignment of iio_info.driver_module 2017-08-22 22:14:52 +01:00
tsys01.c iio:temperature: drop assignment of iio_info.driver_module 2017-08-22 22:14:52 +01:00
tsys02d.c iio:temperature: drop assignment of iio_info.driver_module 2017-08-22 22:14:52 +01:00