This adds support for Lairds CPU module, featuring Atheros wifi, CSR
Bluetooth and, Atmel SAMA5D3 CPU.
https://www.lairdtech.com/products/wb50nbt-wi-fi-bluetooth-module
Signed-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
This adds support for Lairds combo CPU module, featuring on board
Atheros wifi, CSR Bluetooth radio and, Atmel CPU.
https://www.lairdtech.com/products/wb45nbt
Signed-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
This adds labels to commonly used device-tree nodes so that derivative
boards can avoid ahb/apb hierarchy.
Signed-off-by: Ben Whitten <ben.whitten@lairdtech.com>
Signed-off-by: Alexandre Belloni <alexandre.belloni@bootlin.com>
The Pine H64 board have a MicroSD slot connected to MMC0 controller of
the H6 SoC and a eMMC slot connected to MMC2.
Enable them in the device tree.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
The Allwinner H6 SoC have 3 MMC controllers.
Add device tree nodes for them.
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
The MMC controllers on H6 is similar to the ones on A64, but with some
new features.
Add compatible strings for them (with the A64 compatible strings as
fallback, in order to make them to work with A64 drivers).
Signed-off-by: Icenowy Zheng <icenowy@aosc.io>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
According to the system control bindings, the A3-A4 SRAM node should be
a child node of the SRAM it belongs to. However, it was introduced at the
same level, therefore breaking the binding. Fix this.
Fixes: 85870196258f ("ARM: sun5i: a13: Merge common controllers into the common DTSI")
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
address-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
This patch fix the following DT warning:
Warning (avoid_unnecessary_addr_size): /soc/ethernet@1c50000: unnecessary #address-cells/#size-cells without "ranges" or child "reg" property
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
address-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
This patch fix the following DT warning:
Warning (avoid_unnecessary_addr_size): /soc/ethernet@1c50000: unnecessary #address-cells/#size-cells without "ranges" or child "reg" property
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
address-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
This patch fix the following DT warning:
Warning (avoid_unnecessary_addr_size): /soc/ethernet@1c50000: unnecessary #address-cells/#size-cells without "ranges" or child "reg" property
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
ddress-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
This patch fix the following DT warning:
Warning (avoid_unnecessary_addr_size): /soc/ethernet@1c50000: unnecessary #address-cells/#size-cells without "ranges" or child "reg" property
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
address-cells/size-cells is unnecessary for dwmac-sun8i node.
It was in early days, but since a mdio node is used, it could be
removed.
Signed-off-by: Corentin Labbe <clabbe@baylibre.com>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
dts reports incorrect usage of these properties in gpio-keys node.
Warning (avoid_unnecessary_addr_size): /gpio-keys: unnecessary
The patch is removing these useless properties.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Add an LED node, connected to the Processing System (PS)
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Include GPIO dt-bindings and use GPIO_ACTIVE_* constants
to improve readability
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
According to the reference manual, the board has two Micron
MT41K256M16HA-125 DDR3L memory ICs, which have 512 MiB each
Tested on a ZYBO-Z7-20 board
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
The bindings were missing when the device-tree
files were added
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Move the Adapteva Parallela board to Xilinx dt-bindings,
as it's based on a Zynq SoC from Xilinx
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Sort additional compatible strings (boards) alphabetically
by their manufacturer and model number
This will help when finding a board because they
will be grouped by their manufacturer
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Change the description of some boards to make it similar
to the value of the model property from their respective
device-tree, using the format "<manufacturer> <model>"
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Replace the current value of the model property by a more accurate
description of each board (which includes the manufacturer), as some
of the boards had the same value ("Xilinx Zynq")
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Both boards are made by Avnet, Inc. So add an additional
value to the compatible property
Signed-off-by: Luis Araneda <luaraneda@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Add a dts for MYIR Z-turn board and respective target in Makefile.
Signed-off-by: Anton Gerasimov <tossel@gmail.com>
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Avnet Ultra96 rev1 board is commercialized Xilinx zcu100 revC/D
internal board. The patch is reusing zcu100 revC files but changing
model description and compatible strings which are used for example by
libmraa.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
dts reports incorrect usage of these properties in gpio-keys node.
Warning (avoid_unnecessary_addr_size): /gpio-keys: unnecessary
The patch is removing these useless properties.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
Mainline started to use serdev interface for uart attached devices.
Change description to reflect it.
Signed-off-by: Michal Simek <michal.simek@xilinx.com>
This patch adds parallel display support for i.MX6DL Mamoj board
along with relevant backlight through pwm.
LCD power sequence is added by 'Michael Trimarchi'.
Signed-off-by: Simone CIANNI <simone.cianni@bticino.it>
Signed-off-by: Raffaele RECALCATI <raffaele.recalcati@bticino.it>
Signed-off-by: Michael Trimarchi <michael@amarulasolutions.com>
Signed-off-by: Jagan Teki <jagan@amarulasolutions.com>
Reviewed-by: Fabio Estevam <fabio.estevam@nxp.com>
Signed-off-by: Shawn Guo <shawnguo@kernel.org>
This patch adds GPIO for headphone detection on LD11 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
This patch adds GPIO for headphone detection on LD20 global board.
Signed-off-by: Katsuhiro Suzuki <suzuki.katsuhiro@socionext.com>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Masahiro Yamada <yamada.masahiro@socionext.com>
The EValuation Module(EVM) platform for AM654 consists of a
common Base board + one or more of daughter cards, which include:
a) "Personality Modules", which can be specific to a profile, such as
ICSSG enabled or Multi-media (including audio).
b) SERDES modules, which may be 2 lane PCIe or two port PCIe + USB2
c) Camera daughter card
d) various display panels
Among other options. There are two basic configurations defined which
include an "EVM" configuration and "IDK" (Industrial development kit)
which differ in the specific combination of daughter cards that are
used.
To simplify support, we choose to support just the base board as the
core device tree file and all daughter cards would be expected to be
device tree overlays.
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
Add option to build AM6 SoC specific components
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Benjamin Fair <b-fair@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
The AM654 SoC is a lead device of the K3 Multicore SoC architecture
platform, targeted for broad market and industrial control with aim to
meet the complex processing needs of modern embedded products.
Some highlights of this SoC are:
* Quad ARMv8 A53 cores split over two clusters
* GICv3 compliant GIC500
* Configurable L3 Cache and IO-coherent architecture
* Dual lock-step capable R5F uC for safety-critical applications
* High data throughput capable distributed DMA architecture under NAVSS
* Three Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
* Centralized System Controller for Security, Power, and Resource
management.
* Dual ADCSS, eQEP/eCAP, eHRPWM, dual CAN-FD
* Flash subsystem with OSPI and Hyperbus interfaces
* Multimedia capability with CAL, DSS7-UL, SGX544, McASP
* Peripheral connectivity including USB3, PCIE, MMC/SD, GPMC, I2C, SPI,
GPIO
See AM65x Technical Reference Manual (SPRUID7, April 2018)
for further details: http://www.ti.com/lit/pdf/spruid7
NOTE:
1. AM654 is the first of the device variants, hence we introduce a
generic am65.dtsi.
2. We indicate the proper bus topology, the ranges are elaborated in
each bus segment instead of using the top level ranges to make sure
that peripherals in each segment use the address space accurately.
3. Peripherals in each bus segment is maintained in a separate dtsi
allowing for reuse in different bus segment representation from a
different core such as R5. This is also the reason for maintaining a
1-1 address map in the ranges.
4. Cache descriptions follow the ARM64 standard description.
Further tweaks may be necessary as we introduce more complex devices,
but can be introduced in context of the device introduction.
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Benjamin Fair <b-fair@ti.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Tony Lindgren <tony@atomide.com>
The AM654 SoC is a lead device of the K3 Multicore SoC architecture
platform, targeted for broad market and industrial control with aim to
meet the complex processing needs of modern embedded products.
Some highlights of this SoC are:
* Quad ARMv8 A53 cores split over two clusters
* GICv3 compliant GIC500
* Configurable L3 Cache and IO-coherent architecture
* Dual lock-step capable R5F uC for safety-critical applications
* High data throughput capable distributed DMA architecture under NAVSS
* Three Gigabit Industrial Communication Subsystems (ICSSG), each with dual
PRUs and dual RTUs
* Hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
* Centralized System Controller for Security, Power, and Resource
management.
* Dual ADCSS, eQEP/eCAP, eHRPWM, dual CAN-FD
* Flash subsystem with OSPI and Hyperbus interfaces
* Multimedia capability with CAL, DSS7-UL, SGX544, McASP
* Peripheral connectivity including USB3, PCIE, MMC/SD, GPMC, I2C, SPI,
GPIO
See AM65x Technical Reference Manual (SPRUID7, April 2018)
for further details: http://www.ti.com/lit/pdf/spruid7
Reviewed-by: Tony Lindgren <tony@atomide.com>
Signed-off-by: Nishanth Menon <nm@ti.com>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Tony Lindgren <tony@atomide.com>
This patch adds decriptions for mt2712 IOMMU and SMI.
In order to balance the bandwidth, mt2712 has two M4Us, two
smi-commons, 10 smi-larbs. and mt2712 is also MTK IOMMU gen2 which
uses ARM Short-Descriptor translation table format.
The mt2712 M4U-SMI HW diagram is as below:
EMI
|
------------------------------------
| |
M4U0 M4U1
| |
smi-common0 smi-common1
| |
------------------------- --------------------------------
| | | | | | | | | |
| | | | | | | | | |
larb0 larb1 larb2 larb3 larb6 larb4 larb5 larb7 larb8 larb9
disp0 vdec cam venc jpg mdp1/disp1 mdp2/disp2 mdp3 vdo/nr tvd
All the connections are HW fixed, SW can NOT adjust it.
Signed-off-by: Yong Wu <yong.wu@mediatek.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Matthias Brugger <matthias.bgg@gmail.com>
The aspeed pwm driver always sets the clock source to 24MHz, specify
the fixed clock in device tree to make sure the driver is using the
correct clock frequency to calculate the fan speed.
Signed-off-by: Lei YU <mine260309@gmail.com>
Signed-off-by: Joel Stanley <joel@jms.id.au>
The cooling device properties, like "#cooling-cells" and
"dynamic-power-coefficient", should either be present for all the CPUs
of a cluster or none. If these are present only for a subset of CPUs of
a cluster then things will start falling apart as soon as the CPUs are
brought online in a different order. For example, this will happen
because the operating system looks for such properties in the CPU node
it is trying to bring up, so that it can register a cooling device.
Add such missing properties.
Do minor rearrangement as well to keep ordering consistent.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Update entry/exit latency and residency time of hikey960 to use more
realistic figures based on unitary tests done on the platform.
The complete results (in us) :
big cluster
cluster CPU
max entry latency 800 400
max exit latency 2900 550
residency 903Mhz 5000 1500
residency 2363Mhz 0 1500
little cluster
cluster CPU
max entry latency 500 400
max exit latency 1600 650
residency 533Mhz 8000 4500
residency 1844Mhz 0 1500
We can see that the residency time depends of the running OPP which is not
handled for now. Then we also have to take into account the constraint of
a residency time shorter than the tick to get full advantage of idle loop
reordering(tick is stopped if idle duration is higher than tick period).
Finally the selected residency value are :
big cluster
cluster CPU
residency 3700 1500
little cluster
cluster CPU
residency 3500 1500
A simple test with a task waking up every 11.111ms shows improvement:
- 5% a lowest OPP
- 22% at highest OPP
The period has been chosen:
- to be shorter than old cluster residency time and longer than new
residency time of cluster off C-state
- to prevent any sync with tick (4ms) when running tests that can add
some variances between tests
Signed-off-by: Vincent Guittot <vincent.guittot@linaro.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Remove the keep-power-in-suspend property because it keeps wifi power
on during suspend. This property is only required when enabling WoWLAN
and should only be enabled based on need.
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Remove the keep-power-in-suspend property because it keeps wifi power
on during suspend. This property is only required when enabling WoWLAN
and should only be enabled based on need. Also remove dupplicate property
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
Certain properties should be moved to the board file to reflect
the specific properties of the board, and not the SoC. Move these
properties to proper location and organize properties in both files.
Signed-off-by: Ryan Grachek <ryan@edited.us>
Signed-off-by: Wei Xu <xuwei5@hisilicon.com>
The "Beaglebone Enhanced" by Sancloud is based on the Beaglebone Black,
but with the following differences:
* Gigabit capable PHY
* Extra USB hub, optional i2c control
* lps3331ap barometer connected over i2c
* MPU6050 6 axis MEMS accelerometer/gyro connected over i2c
* 1GiB DDR3 RAM
* RTL8723 Wifi/Bluetooth connected over USB
Tested on a revision G board.
Signed-off-by: Koen Kooi <koen@dominion.thruhere.net>
Signed-off-by: Tony Lindgren <tony@atomide.com>
